Electromechanics, ICT, key markets get boost in new shares exchange30 July 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and TECO Electric & Machinery Co Ltd (“TECO”) (TWSE:1504) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race. The move brings together the strengths of Foxconn, the world’s largest electronics manufacturing service provider and AI server producer, and TECO, a leader in industrial electro-mechanical engineering and green energy innovation. Seizing on the development of global AI data center (AIDC) construction towards standardization and modularization, the two companies will jointly explore AIDC business opportunities. Global customers will be able to tap comprehensive data center modular products, electromechanical engineering services, and cost-competitive, one-stop solutions. According to terms approved by both boards, respectively, TECO will take a 0.519% stake in Hon Hai Precision Industry Co Ltd, the formal name Foxconn trades on at the Taiwan Stock Exchange. In turn, Foxconn will own 10% in TECO. The latter will issue 237,644,068 new shares to Foxconn, and Foxconn will issue 72,481,441 new shares to TECO, implying a share exchange ratio of approx. 1 to 0.305. The no-cash transaction is targeted to complete in the fourth quarter of this year, conditional on regulatory approvals. Foxconn Chairman Young Liu said, “Time-to-market is key in the global super-computing race. Modular design is gaining popularity. As AI data centers grow in size and demand ramps higher, teaming up with TECO means both companies are able to level up and rapidly deliver comprehensive, vertically-integrated solutions to our customers – the Tier-1 CSPs and hyperscalers.” TECO Chairman Morris Li said, “Changing global dynamics are creating new opportunities for business and cooperation. The strategic partnership extends the two companies’ cooperation in the fields of low-carbon smart factories and energy services, toward being a one-stop solution for data centers going forward.” Target markets cover Taiwan and Asia, as well as the Middle East and the US. Foxconn has deep vertical integration capabilities in manufacturing AI server racks and an unrivaled customer base. Liu said Foxconn will actively develop a modular architecture for AI data centers, and with TECO aim to extend the value chain from server components and racks to data center construction. Li said that Texas-based TECO-Westinghouse, a longstanding world leader in manufacturing electric motors, has the advantages of American manufacturing and local services. Together with Foxconn's manufacturing base in the United States, it is in line with the strategic direction of the two companies to expand American manufacturing and reshape the global supply chain. Previously cooperating in factory energy saving and emission reduction, and ESCO energy services, TECO and Foxconn have started discussions on establishing data center business in Taiwan and the United States. Since a data center is mainly composed of equipment inside the computer room (servers, cooling systems, UPS, etc.) and power infrastructure outside the computer room, the strategic alliance integrates the combined strengths each bring in their respective fields of AI servers, electromechanics, and information and communications. Going forward, the strategic alliance will explore the possibility of expanding cooperation in Foxconn’s “3+3+3” areas. As bellwethers in sustainability, both companies will use the strategic alliance as a starting point to enhance a low-carbon smart industry chain that aligns with international trends, and support supply chain resiliency and innovation. Both TECO and Foxconn were named in S&P Global’s Sustainability Yearbook 2025, a milestone ranking that demonstrates corporate sustainability strength.   About TECO Founded in 1956 as a motor manufacturer, TECO Electric & Machinery Co., Ltd. (“TECO”) has grown into one of the world’s top five industrial motor producers. Today, TECO operates across three core business groups—Green Mechatronic Solutions, Intelligence Energy, and Air & Intelligent Life—building a green ecosystem for energy generation, storage, and efficiency. Beyond motors, TECO has expanded into ESCO energy services, EV powertrain systems, and data center engineering. The company is a market leader in Taiwan’s onshore substations for offshore wind (2.5 GW), has delivered over 700 MW of data center projects across Southeast Asia, and holds more than 85% of Taiwan’s e-bus powertrain market, with recent expansion into India. TECO’s vision is to become the key driver in realizing global electrification, intelligence, and green energy. It has been included for five consecutive years in both the Dow Jones Best in Class Indices and the S&P Global Sustainability Yearbook, and has received the Taiwan Corporate Sustainability Award for eleven straight years. To learn more, visit www.teco.com.tw   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

Multimodal Trajectory Prediction Model Competitively Recognized Internationally10 July 2025, Taipei, Taiwan – Hon Hai Research Institute (HHRI), an R&D powerhouse of Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, has been recognized for its competitive work in trajectory prediction in autonomous driving technology. The landmark achievements in ModeSeq, taking top spot in the Waymo Open Dataset Challenge and presenting at CVPR 2025, among the world’s most influential AI and computer vision conferences, gathering top-tier tech firms, research institutions, and academic leaders, highlight HHRI’s growing leadership and technical excellence on the international stage. “ModeSeq empowers autonomous vehicles with more accurate and diverse predictions of traffic participant behaviors,” said Yung-Hui Li, Director of the Artificial Intelligence Research Center at HHRI. “It directly enhances decision-making safety, reduces computational cost, and introduces unique mode-extrapolation capabilities to dynamically adjust the number of predicted behavior modes based on scenario uncertainty.”Figure 1: Illustrates the ModeSeq workflow, showing how the model anticipates multiple possible future trajectories (highlighted by red vehicle icons and arrows). It progressively analyzes the scenario and assigns confidence scores (e.g., 0.2) to each potential path.   HHRI’s Artificial Intelligence Research Center, in collaboration with City University of Hong Kong, on June 13, presented "ModeSeq: Taming Sparse Multimodal Motion Prediction with Sequential Mode Modeling" at CVPR 2025(IEEE/CVF Conference on Computer Vision and Pattern Recognition), where its paper was among only the 22% that were accepted. The multimodal trajectory-prediction technology overcomes the limitations of prior methods by both preserving high performance and delivering diverse potential outcome paths. ModeSeq introduces sequential pattern modeling and employs an Early-Match-Take-All (EMTA) loss function to reinforce multimodal predictions. It encodes scenes using Factorized Transformers and decodes them with a hybrid architecture combining Memory Transformers and dedicated ModeSeq layers. The research team further refined it into Parallel ModeSeq, which claimed victory in the prestigious Waymo Open Dataset (WOD) Challenge – Interaction Prediction Track at the CVPR WAD Workshop. The team’s winning entry surpassed strong competitors from the National University of Singapore, University of British Columbia, Vector Institute for AI, University of Waterloo and Georgia Institute of Technology. Building on their success from last year – where ModeSeq placed second globally in the 2024 CVPR Waymo Motion Prediction Challenge – this year’s Parallel ModeSeq emerged triumphant in the 2025 Interaction Prediction track. Led by Director Li of HHRI’s AI Research Lab, in collaboration with Professor Jianping Wang’s group at City University of Hong Kong and researchers from Carnegie Mellon University, ModeSeq outperforms previous approaches on the Motion Prediction Benchmark—achieving superior mAP and soft-mAP scores while maintaining comparable minADE and minFDE metrics. Figure 2: Director Yung-Hui Li (right) and Researcher Ming-Chien Hsu at CVPR 2025 presenting the latest advances in autonomous driving using ModeSeq.   About Hon Hai Research Institute Founded in 2020 under Hon Hai Technology Group, the institute comprises five research centers and one laboratory. Each unit houses high-tech researchers dedicated to forward-looking studies over a 3–7 year horizon. Their mission is to strengthen long-term innovation and product development to support Foxconn’s transformation toward a “Smart First” future and to bolster the company’s “3+3+3” strategic operating model.

Pioneering a new foundation for quantum cryptography with meta-complexity13 June 2025, Taipei, Taiwan  – Hon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing. Researchers from HHRI’s Quantum Computing Division have demonstrated the possibility of constructing quantum cryptography without relying on traditional one-way functions, using instead a novel theoretical framework known as meta-complexity. This groundbreaking result has been accepted at Crypto, the world’s leading conference in cryptography, highlighting HHRI’s advanced research capabilities and its growing influence in the global quantum technology landscape. Figure 1: Overview of the relationships between key quantum cryptographic primitives and quantum computational complexity. Black lines indicate known results or straightforward inferences; red lines highlight HHRI’s new discoveries.This groundbreaking research, led by Dr. Taiga Hirooka, a researcher at HHRI, in collaboration with Professor Tomoyuki Morimae of Kyoto University and scientific advisor to HHRI, is the first to establish a deep theoretical connection between core tools in quantum cryptography—such as one-way puzzles and quantum random number generators—and a fundamental decision problem known as GapK. The GapK problem centers on determining whether a given piece of information is intrinsically complex or can be succinctly described, offering a novel lens through which to understand the foundations of quantum cryptography.   This discovery not only establishes a new theoretical foundation for quantum cryptography, but also paves the way for the development of next-generation Proofs of Quantumness—a critical step toward constructing secure and verifiable quantum technologies. The work aligns with concurrent research from two international teams and is widely seen as marking a new chapter in the evolution of quantum cryptography.   Crypto (International Cryptology Conference) is one of the most prestigious and longest-running academic conferences in the field of cryptography. Established in 1981, it has become a cornerstone of the discipline—alongside Eurocrypt and Asiacrypt—and is one of the three flagship events organized by the International Association for Cryptologic Research (IACR). Crypto attracts leading researchers and industry pioneers from around the globe and has served as the launchpad for numerous foundational advances in cryptographic theory and practice. Publishing at Crypto is widely regarded as one of the highest honors in the field, representing a hallmark of excellence in theoretical rigor, technical innovation, and lasting impact.   HHRI’s latest breakthrough, now accepted at Crypto, not only enhances Taiwan’s presence in the field of quantum cryptography but also highlights Foxconn’s sustained investment and growing expertise in quantum computing. The Hon Hai Research Institute will continue to advance quantum computing research to drive global technological innovation and industrial progress. Crypto 2025：https://crypto.iacr.org/2025/   About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has an average of 40 high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy.