NVIDIA technologies support clinical AI orchestration, runtime security and digital twins across Foxconn’s healthcare ecosystemOctober 2026, Taipei, Taiwan – At Hon Hai Tech Day 2026 (HHTD26), Foxconn’s Smart Healthcare exhibition showcases its vision for AI-driven healthcare across the care continuum, organized around three key areas: AI-Assisted Diagnosis & Digital Twins, Embodied AI, and Smart Healthcare Manufacturing. By integrating AI agents, embodied AI, and multimodal medical models, Foxconn connects clinical decision-making with intelligent devices, hospital workflows, and manufacturing capabilities. The exhibition demonstrates Foxconn’s end-to-end integration expertise, spanning AI software, edge computing, robotics, and healthcare manufacturing to build a comprehensive smart healthcare value chain. Foxconn brings together its ecosystem, real-world deployment environments, products, edge-to-cloud infrastructure, and hardware-software integration. Aligned with NVIDIA’s “Five-Layer Cake” AI strategic framework, this approach connects AI technologies with intelligent medical devices and real clinical environments, advancing healthcare AI from individual proof-of-concept applications toward integrated systems and real-world clinical deployment. CoDoClaw: Advancing from AI Models to Clinical AI Agents As a key highlight of the exhibition, CoDoClaw, Foxconn’s Clinical AI Orchestrator, marks a significant milestone in the evolution from AI models to AI agents. Jointly developed by Foxconn and Tung’s Taichung MetroHarbor Hospital, CoDoClaw focuses on diabetes and cardiometabolic multimorbidity management. By integrating multimodal medical models with agentic AI, it connects data and AI capabilities across specialties and healthcare systems, advancing clinical applications from standalone diagnostic support to cross-specialty decision-making and workflow coordination. Built on NVIDIA NemoClaw open agent blueprint and NVIDIA OpenShell secure runtime software, CoDoClaw is designed to interpret clinical contexts, reason through tasks, and orchestrate AI agents within defined clinical workflows. To address the stringent security requirements of healthcare environments, CoDoClaw integrates centralized security policy management, sandbox isolation, and runtime access controls, alongside NVIDIA Sentryagent identity and delegated authority verification capabilities. Together, these mechanisms strengthen runtime security, mitigate risks such as unauthorized actions, sensitive data exposure, and credential leakage, and establish a trusted foundation for the responsible adoption of autonomous AI agents in clinical settings. Extending AI Clinical Capabilities Across Diverse Healthcare Settings Foxconn is also extending its AI-powered clinical capabilities into a variety of diagnostic and care environments. In the telemedicine zone, CoDoctor EKG Screener, an AI-powered electrocardiogram analysis system, brings real-time cardiovascular risk screening and anomaly alerts beyond hospitals into home-based care, community healthcare, and postoperative monitoring environments. At the endoscopy center, CoDoctor Endovia, an AI-assisted colonoscopy analysis software solution, is jointly developed by Foxconn, Kaohsiung Medical University Chung-Ho Memorial Hospital, YUAN High-Tech, Yuan Yu Industry, By integrating edge AI into endoscopic examination workflows, the solution provides real-time lesion detection, pathological classification, bowel preparation quality monitoring, withdrawal speed analysis, and intraoperative 3D navigation. These capabilities help improve examination quality and diagnostic consistency. Integrated Chemotherapy Compounding and Delivery System A major exhibition highlight is the Integrated Chemotherapy Compounding and Delivery System, developed through collaboration among Foxconn, Taipei Veterans General Hospital, Kawasaki Heavy Industries, Yuyama Manufacturing, and FARobot. The system brings together automated medication compounding, in-hospital logistics, and clinical delivery into an integrated healthcare automation ecosystem. Using NVIDIA Omniverse libraries, Foxconn builds digital twins to simulate and evaluate chemotherapy compounding, robotic transport and delivery workflows before deployment, allowing  high-risk chemotherapy workflows to be simulated, monitored, and continuously optimized. It integrates ChemoRo the Spike automated chemotherapy compounding equipment, FARobot autonomous mobile robots, and Foxconn’s Nurabot nursing collaborative robot to coordinate the entire workflow, from compounding and transportation to distribution and clinical delivery. By connecting these systems into a coordinated, end-to-end workflow, Foxconn aims to enhance medication safety, improve clinical efficiency, and increase operational reliability in complex hospital environments.

·      MODEL A+expands B2B product portfolios in fastest-growing B-segment SUV ·      MODEL K+ SUV playful styling gives nostalgic touches of Japan with neo city pop ·      MODEL Ktaps into kei-class trucks with design language of MODEL T ·      Flexing CDMS strength to accelerate electromobility for automotive clients30 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317) on Friday flexed its contract design and manufacturing service (CDMS) strength for automotive clients by unveiling three new reference electric vehicles aimed at under-penetrated markets, while offering cost competitive options and flexible design platforms. Two eye-catching SUVs, the MODEL A+ and MODEL K+, alongside the MODEL K compact truck, extend Foxconn’s electromobility progress into the kei-class trucks popular in Japan and brings the Group’s EV range to a total of 12 reference models. “The new reference EVs join Foxconn’s emerging ecosystem in electromobility that is accelerating time-to-market, time-to-cost and time-to-technology for our customers and partners,” said Jun Seki, Foxconn Chief Strategy Officer for EV. All three new models were on display at Hon Hai Tech Day 2026 (HHTD26), the flagship annual technology conference of the world’s largest electronics manufacturer and the world premiere stage for the Group’s B2B electric vehicles. On the exhibition floor in Taipei, Foxconn’s electromobility ecosystem included demos of full stack, made in Taiwan battery developments from materials to cells and packs to BMS; E/E architecture; and powertrains for E2W and E3W. Among EVs on display, a right-hand drive MODEL B gave attendees a chance to check out the result of CDMS collaboration, while onstage, Honda R&D and Mitsubishi Electric Mobility discussed, in separate remarks, their electromobility developments with Foxconn. MODEL A+ An expressive luxury style yet authentic SUV for affluent drivers, the MODEL A+ is a deliberate move to expand B2B product portfolios in the fastest-growing B-segment SUV. With In-Wheel Motor technology and selectable EEA, a wild exterior design but ultimate space interior addresses flood capability emergencies, temporary living space and backup power for glamping and camping eletromobility lifestyles.   MODEL K+ This is an expressive yet affordable SUV designed for active youth. Playful styling with nostalgic touches recall Japan’s city pop music era of the ‘70s and ‘80s, but with a neo city pop take for the modern day. The highly distinctive lifestyle SUVfor a niche market targets B2B looking to develop their own brand’s lifestyle SUV EV, as well as OEMs looking to offer affordable yet distinctive vehicles for younger customers. With In-Wheel Motor technology, the MODEL K+ offers personalization of exterior, interior, driving range, and EEA for purpose-built capability at a competitive price. MODEL K This is a functional yet futuristic truck for forward-thinking business owners. Aimed at the specialized commercial kei truck class, the MODEL K finds use as last-mile and mobility service applications. Its alignment to support compliance to environmental regulations makes it attractive for decarbonization-focused entrepreneurs, municipalities, and government agencies while offering lower total cost of ownership (TCO) through reduced energy and maintenance costs.A functional beauty, inspired by the design language of Foxconn’s award-winning MODEL T electric bus, the canopy-ready MODEL K conceptualizes a lower bed height and longer bed length. Other reference EV models to-date: ·      MODEL T large bus ·      MODEL C passenger SUV ·      MODEL E luxury sedan ·      MODEL B crossover SUV ·      MODEL V truck ·      MODEL N cargo van ·      MODEL D LMUV ·      MODEL U midi-bus ·      MODEL A modular B-segment  

·      Flagship annual technology conference held for 7th year, celebrates tech partnerships ·      Record 321 exhibits demonstrate vertical integration and precision manufacturing ·      20-meter long wall shows components to system integration of next-gen AI infra ·      Most embodied intelligence assembled at HHTD2630 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday confirmed its industrial leadership in token factory solutions with an unprecedented look at components and system technologies enabling next generation AI infrastructure and by giving spotlight to its storied partnerships for the first time. At the 7th annual Hon Hai Tech Day 2026 (HHTD26), Foxconn laid bare the world-beating vertical integration and precision manufacturing strengths behind its work on the NVIDIA Vera Rubin platform, from rack-level full AI supercomputing system integration to sub-micron-level component manufacturing technologies. In two firsts, Foxconn showcased NVIDIA DSX POD, a standardized, factory-built reference design that enables partners to preintegrate NVIDIA Vera Rubin rack-scale AI infrastructure in modular containers, complete critical validation before shipment and connect the units to prepared site infrastructure after delivery, dominated the venue and welcomed visitors, while a new customer zone with key moment photos and milestone technology timelines paid homage to behind-the-scenes partnerships that have captured the imagination of the technology industry. “Foxconn is transforming into a technology manufacturing platform service provider,” said Foxconn Chairman Young Liu. “From testing to the tangible, our vertical integration and precision manufacturing makes the impossible possible. We are building this kind of strength across ecosystems of smart consumer electronics to AI and EV, as well as in space and robotics.” Among a record 321 exhibits at HHTD26, a quarter comprised the Token Factory zone. Extreme co-design is a visual tour at a 20-meter long wall exhibiting PCBs mounted with tens of thousands of micron-level precision-engineered components; AI server cable-free, hose-free and fanless compute tray design in a single generation; next AI megatrend co-packaged optics (CPO); and power, cooling and high-speed data solutions re-imagined for more efficient AI infrastructure. An immersive simulated AI data hall demonstrated how AI compute, networking, power and cooling are co-designed for an AI factory, including NVIDIA 800 VDC power distribution. Foxconn’s dedicated business unit for AI supercomputing & cloud operations and an NVIDIA Cloud Partner, Visionbay.ai, is planning its facility design to follow NVIDIA DSX MaxLPS principles to maximize AI factory performance per watt within a fixed power envelope and optimize computing, power and cooling configurations ahead of construction. Onstage, NVIDIA, Google LLC, and Schneider Electric discussed AI infrastructure; Honda R&D Co Ltd and Mitsubishi Electric Mobility discussed next generation electromobility. The most embodied intelligence for HHTD26 assembled in the Robotics and Humanoid zone, showing the potential of a growing ecosystem and demonstrating real-world application examples of industrial products used in robotics. In another first, Foxconn leaned into its rich heritage in ultra-precision manufacturing processes backed by its proprietary machining, materials processing, and mold making equipment with a Precision Manufacturing zone dotted with technologies that have resulted in Poketomo AI companion robots and one-punch enclosures for laptops. Among the exhibits, the importance of AI safety was a common thread as Foxconn teams demonstrated how the NVIDIA Open Agent Safety Platform could support agent safety across smart healthcare, smart manufacturing and robotics, and smart city. HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference launched for the first time a family-friendly pavilion for children to experience hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city. For more on Hon Hai Tech Day 2026 here. About Foxconn here.

30 October 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and AI server provider, on Friday showcased modular container built on NVIDIA DSX POD, the fastest path to productive intelligence at scale, to its annual technology fest in Taipei. NVIDIA DSX POD is a reference design for complete NVIDIA Vera Rubin AI factories inside modular containers, integrated and validated before delivery. The units arrive ready to connect out of the box to a prepared site’s power, cooling, networking and other supporting infrastructure, reducing deployment time from six months to as little as 14 days. Partners, including Foxconn, complete rack-to-rack cabling, wiring, piping and functional validation before shipment. The DSX POD-based modular container at the 7th annual Hon Hai Tech Day 2026 (HHTD26) represents the strong, long-standing collaboration between NVIDIA and Foxconn and comes on the heels of its recent announcement at NVIDIA GTC Berlin. HHTD26 runs from October 30-31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day annual conference is attracting thousands of attendees. Free entry on the second day, a family-friendly pavilion opens for the first time for children to experience hands-on exploratory themes for the young include sustainability, mobility, smart factory and smart city.

Foxconn is building an AI factory that turns industrial data into intelligence to power a self-learning manufacturing ecosystem. Using NVIDIA infrastructure and software, the company trains AI models and deploys specialized agents that support real-time decisions across manufacturing, electric vehicles, and smart cities. At the center is FoxBrain, Foxconn’s proprietary large language model, developed by adapting open foundation models with industrial data. FoxBrain supports specialized platforms, including Genesis for manufacturing and CityGPT for urban services. NVIDIA DGX SuperPOD serves as the AI factory’s training foundation. Foxconn reports 2.48x faster training for 120-billion-parameter models compared with its previous H100-based systems, processing one trillion tokens in 12 days. NVIDIA software helps manage infrastructure and deploy AI agents across more than 200 facilities. The company reports practical manufacturing improvements: 25% fewer labor hours spent on production scheduling. 50% less engineering workload for injection-molding process changeovers. More than 20 major defect root causes addressed, with a correction rate exceeding 90%, on surface-mount production lines. Foxconn also uses NVIDIA RTX PRO servers, Omniverse, and Isaac to simulate factories and robots before deployment, helping replicate production lines globally. Through its subsidiary Visionbay.ai, an NVIDIA Cloud Partner, Foxconn is extending its AI factory leveraging NVIDIA-Certified Systems to deliver AI-as-a-Service to enterprises and governments across Asia. Discover how Foxconn and NVIDIA are architecting the future of industrial intelligence. Read the full Foxconn DGX SuperPOD case study.

Will leverage “Made in/by Japan” brand to support sustainable growth of Japanese automotive industry16 October 2026, Taipei, Taiwan, Tokyo Japan – Lin Yin International Investment Co., Ltd. (Lin Yin), an investment management subsidiary of Hon Hai Precision Industry Co., Ltd. (Hon Hai Precision Industry) (Foxconn), and Mitsubishi Electric Corporation (Mitsubishi Electric) announced today that they have formalized a strategic alliance for the joint operation of an automotive equipment business. Through the alliance, the companies aim to develop next-generation mobility and thereby strengthen the sustainable growth of the Japanese automotive industry. Under the agreement, Mitsubishi Electric will transfer to Lin Yin 50% of its stake in Mitsubishi Electric Mobility Co., Ltd., which handles Mitsubishi Electric’s automotive equipment business, after which the two co-owners will jointly operate Mitsubishi Electric Mobility. The share transfer price is expected to be JPY 115.0 billion. The share transfer agreement establishes an enterprise value of JPY 320.0 billion and an equity value of 230.0 billion for the target business. The transfer price corresponds to a 50% stake to be transferred based on the equity value. Subject to the satisfaction of contractual conditions, including obtaining required approvals and clearances from relevant authorities under competition laws and other applicable laws and regulations, the share transfer is expected to be completed on October 1, 2027. The joint-operating arrangement will combine Mitsubishi Electric Mobility’s technological and developmental capabilities, particularly in electric powertrains, software and vehicle control, with Hon Hai Precision Industry’s speed, scale and other strengths in market deployment. By providing high-quality electric-vehicle platforms (basic structures) developed in Japan, the companies expect to contribute to the widespread adoption and advancement of next-generation mobility. The alliance will translate advanced technologies and quality achieved through high-level Japanese manufacturing into new value for mobility. In turn, this is expected to strengthen Japan’s industrial base and support the sustainable growth of the domestic automotive industry. In addition, over the medium to long term, the companies aim to expand Japanese technology and quality to global markets as well as further enhance the value of “Made in/by Japan” and demonstrate new possibilities for Japanese manufacturing to the world. About Hon Hai Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 1 million employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us About the Mitsubishi Electric Group Guided by its corporate philosophy, Mitsubishi Electric Corporation (TOKYO: 6503) places sustainability at the core of its operations and values stakeholder trust—encompassing society, customers, shareholders and employees. In pursuing profitability, capital efficiency and growth, Mitsubishi Electric works closely alongside customers to develop value-added solutions that address today’s complex challenges while enhancing the company’s sustainable corporate value. Founded in 1921, Mitsubishi Electric has over a century of experience in delivering reliable, high-quality products and solutions. With over 200 group companies and approximately 150,000 employees worldwide, the company is a recognized global leader in manufacturing, marketing and selling electrical and electronic equipment and systems across a broad range of sectors, including public utility systems, energy systems, defense and space systems, factory automation systems, automotive equipment, building systems, air conditioning systems & home products, digital innovations, and semiconductor & devices. Mitsubishi Electric recorded consolidated revenue of 5,894.7 billion yen (U.S.$ 36.8 billion*) in the fiscal year that ended on March 31, 2026. For more information, please visit www.MitsubishiElectric.com *JPY 160=USD 1, the approximate rate on the Tokyo Foreign Exchange Market on March 31, 2026

08 October 2026, Taipei, Taiwan – Demonstrating its strong forward-looking R&D capabilities, two fundamental theoretical studies from the Hon Hai Research Institute, under Hon Hai Technology Group (Foxconn), have been accepted by the IEEE Symposium on Foundations of Computer Science (FOCS 2026), universally recognized as the highest distinction in theoretical computer science. The 67th Annual FOCS 2026 will take place from November 8-11, 2026, in New York City, USA. As a flagship conference hosted by IEEE, FOCS stands alongside ACM's STOC as the premier academic venue in global theoretical computer science. The conference focuses on underlying mathematical theories such as algorithm design, computational complexity, cryptography, and quantum computing. The studies were conducted by Min-Hsiu Hsieh, Director of HHRI’s Quantum Computing Research Center, Researcher Michael de Oliveira, Intern Ding-Jun Lin, Intern Adam Wills, and an international collaborative team have both. The two accepted papers—"Worst-case depth hierarchy for shallow quantum circuits" (arXiv:2606.16425) and "Linear-Time Encodable and Decodable Quantum Error-Correcting Codes" (arXiv:2603.04543)—are not only the annual flagship achievements of the Hon Hai Research Institute’s Quantum Computing Research Center, but FOCS itself is a top-tier global theoretical computer science conference with an extremely high acceptance threshold. Notably, among all papers accepted by FOCS this year, Hon Hai Research Institute is the sole research entity representing Taiwan, fully highlighting Foxconn’s leadership in key foundational infrastructure for next-generation quantum technology. Mapping the Limits of Quantum Computational Power to Guide Algorithm Design The first accepted paper, "Worst-case depth hierarchy for shallow quantum circuits," focuses on the "depth hierarchy theory for shallow quantum circuits." In quantum computing, "circuit depth" resembles the total number of sequential steps that must be executed (equivalent to run time). Current quantum hardware, limited by technology, can only execute "shallow computations" with few steps and short run times. However, the scientific community has historically struggled to rigorously prove precisely how much of a leap in quantum computational capability occurs if the run time is increased by just a few additional steps. HHRI’s research team successfully established a mathematical framework that rigorously proves that for every additional layer of computational steps, the problem-solving domain of a quantum computer exhibits a distinct "hierarchical jump." This result is akin to mapping a precise "quantum computational capability chart," helping scientists worldwide clearly grasp the boundaries of current quantum devices, enabling the development of more efficient algorithms, and accelerating the realization of high-performance quantum computers. Equipping Qubits with "Ultra-Fast Protective Armor" to Build Ultra-Low Latency Error-Correction Technology The second paper, "Linear-Time Encodable and Decodable Quantum Error-Correcting Codes," tackles the most challenging noise issue in quantum computing—"linear-time encodable and decodable quantum error-correcting codes." While quantum computers possess immense processing power, qubits are extremely fragile. Minor temperature fluctuations or noise interference from the surrounding environment can instantaneously collapse the computational information. Therefore, quantum computers must detect and repair errors in real time within extremely short timeframes. However, if the computation for error correction and encoding is overly complex and time-consuming, qubits will degrade before the errors can even be fixed. The Quantum Computing Research Center team successfully developed an innovative encoding and decoding architecture that vastly simplifies the correction process, allowing computers to complete error-correction in highly efficient "linear time." This breakthrough is like equipping qubits with smart armor capable of "instant self-repair," laying a crucial cornerstone for building large-scale, stably operating quantum computers and quantum communication networks in the future. Cultivating Foundational Theory to Lead Next-Generation Technology Quantum technology is regarded as the core technology set to disrupt future cybersecurity, materials science, finance, and artificial intelligence. Yet, every hardware engineering breakthrough must be built on a foundation of underlying mathematics and algorithmic theory. HHRI director Hsieh stated that being the sole selection from Taiwan at this top-tier conference not only demonstrates that Taiwan's research in quantum foundational theory has reached world-class standards, but also confirms Foxconn’s commitment to cultivating advanced science and nurturing young scientific talent. Moving forward, the Quantum Computing Research Center will continue to collaborate with world-class research teams to provide the most solid theoretical support for next-generation technological infrastructure.

Chairman & chip chief each sit for fireside chats at record SEMICON Taiwan 2 September 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest electronics manufacturer and AI server provider, sees integration across the entire technology value chain to enhance ecosystem collaboration, flexibility and supply chain resilience as the way to stay ahead in next generation artificial intelligence infrastructure, with top executives stepping out this week to talk about what’s next in AI at major semiconductor conferences.  “Made With Taiwan” gives new meaning to an ecosystem collaborating with extreme efficiency because it can adapt fast amd move faster, and as systems are being optimized for intelligence, according to Foxconn executives driving upstream microelectronics development and world-beating AI infra build, at the annual SEMICON Taiwan on Wednesday and imec’s biennial ITF Taiwan on Monday. Young Liu, Foxconn Chairman, at Fireside Chat: Technology, Trust, and the Responsibilityof Innovation: “Because of AI, everything is speeding up. The whole world has to work collectively. We have to think differently. From now on, we have to think about how to ‘Made With Taiwan’, not ‘Made In Taiwan’”. Dr Bob Chen, President of Semiconductor Business Group at Foxconn, at Fireside Chat:From Silicon to Systems: Scaling AI infrastructure: “Organizations are no longer investing in infrastructure simply to run applications; they are building platforms to generate intelligence. The system itself becomes the new unit of innovation and competition. The industry is moving beyond optimizing individual components toward optimizing the entire stack.” The next major breakthroughs in AI will likely come from system architecture, that could bring compute, memory, connectivity, and power physically closer together through chiplets, 3D integration, silicon photonics, and memory-centric architecture, so that the AI system produces more intelligence per watt, said Chen in his conversation with imec CEO Patrick Vandenamelee. Semiconductor and system innovation are now tightly coupled with decisions made at the device, package, interconnect and system levels. Chen said this creates an important opportunity for collaboration between industrial system builders such as Foxconn and leading research hubs like imec. In a rare conversation among five Taiwanese tech titans on stage, Liu – who also heads TEEMA, which represents Taiwan’s technology supply chain of over 3,000 manufacturers of ICT products, semiconductors, automotive components and more – said the scale and speed of change in the AI industry is unprecedented. But Taiwan can adapt very quickly and move even faster, making it a best fit for customers and partner countries to share, collaborate and thrive together from the dividends of AI. With its partner programs and co-located events, SEMICON Taiwan is setting records this year. Foxconn’s support was visible with its active participation in collaborative tech fests, including Power and Compound Semiconductor Forum | NeXT Forum, co-hosted by the Hon Hai Research Institute; and the Quantum Taiwan Forum, opened by Dr Ching-Ray Chang, a Foxconn board director and a UNESCO Quantum 100 Honoree. The quantum industry is reaching a pivotal point. The landscape of quantum production and commercialization is moving from laboratories to fabs, from classrooms to cleanrooms, and from qubits to profits. The quantum forum was designed not only as an exchange platform, but to deeply integrate international innovations with Taiwan’s premier semiconductor and advanced packaging ecosystems, laying the hardware foundation for the next-generation quantum industry.   About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 23rd in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

Delivers Production-Grade AI Infra to Accelerate Enterprise AI Adoption Through a Tokenized AI Factory【31 July 2026, Taipei, Taiwan】Visionbay.ai (“Visionbay”), an NVIDIA Cloud Partner (NCP) in Taiwan, today announced the commercial launch of its first 5MW AI cluster powered by NVIDIA HGX B300 systems, the largest deployment of its kind nationwide. Featuring direct liquid cooling, a 2N high-availability architecture, and connected with NVIDIA Quantum-X800 InfiniBand networking, the cluster is purpose-built for large-scale AI training and inference. It has already signed its first long-term enterprise customers and has entered commercial operation with utilization exceeding 90%. Together, these milestones position Visionbay as one of the leading AI infrastructure providers in the Asia-Pacific region. The cluster has also achieved NVIDIA Exemplar Cloud validation for training workloads on NVIDIA HGX B300, making Visionbay one of the first ten organizations globally — and the second in Asia — to achieve NVIDIA Exemplar Cloud validation as an NVIDIA Cloud Partner. The achievement underscores Visionbay's ability to deliver world-class AI infrastructure and software operations at enterprise scale.   As generative AI, agentic AI, and multimodal foundation models advance, enterprises need more than access to GPUs — they need infrastructure that can reliably support production environments. NVIDIA Exemplar Cloud is a validation initiative  to optimize infrastructure for predictable, production-scale AI performance. Using the NVIDIA Performance Benchmarking and real-world LLM workloads, including DeepSeek-V3, Llama 3.1, Qwen3, and Grok-1, the validation verifies compute performance, network efficiency, cluster stability, and long-duration operational consistency. For enterprise customers, it provides independent assurance that a platform is ready for production deployment — reducing risk and accelerating AI adoption at scale. The achievement also reinforces Visionbay's vision of building a Tokenized AI Factory. Unlike conventional GPU cloud platforms, Visionbay unifies AI infrastructure, GPU cloud services, an AI operations platform, and Token Factory capabilities into a single platform supporting the entire AI lifecycle — from model training and fine-tuning to inference and AI agent deployment. Operating its data center to Tier III-class standards with enterprise-grade security, Visionbay delivers Day-1 operational readiness, ensuring large-scale GPU clusters can be continuously managed, optimized, and delivered as an enterprise service. This helps enterprises accelerate AI commercialization while lowering operational complexity and deployment risk. Looking ahead, Visionbay will continue expanding its AI infrastructure across the Asia-Pacific region powered by NVIDIA Blackwell and NVIDIA Vera Rubin architectures. Leveraging Foxconn's vertically integrated strengths in critical components, AI infrastructure, and AI software platforms, Visionbay is building an end-to-end Tokenized AI Factory that empowers enterprises, governments, and ecosystem partners to scale AI innovation and help shape the next wave of the AI economy. AboutVisionbay.ai Visionbay.ai is the Hon Hai Technology Group’s dedicated business unit for supercomputing and cloud-AI operations. With a mission to empower Asia’s AI ecosystem, Visionbay.ai integrates national-level computing infrastructure with Hon Hai’s deep strengths in manufacturing, design, and supply-chain orchestration. Its end-to-end AI Factory solutions span high-performance compute, cloud operations, supply-chain integration, AI model and tool development, and an AI App Store. Visionbay.ai helps enterprises accelerate digital and AI transformation while building a trusted and sustainable sovereign-AI ecosystem. To learn more, visit  www.visionbay.ai

26 June 2026, Taipei, Taiwan and Pardubice, the Czech Republic – Hon Hai Technology Group (Foxconn) (TWSE:2317) hosted the Czech Tech Day technology exhibition at its Pardubice facility, showcasing the latest high-tech products shaping the present and future of industry. Visitors had a unique opportunity to see these technologies from Foxconn’s global portfolio in the Czech Republic for the very first time, just days after their presentation at the prestigious VivaTech exhibition in Paris. The event offered a comprehensive overview of the key areas driving today’s technological transformation – from artificial intelligence and advanced robotics to electric mobility. Foxconn also demonstrated its role as a technology leader and strategic business partner, connecting global innovation with local manufacturing. Czech Tech Day was attended by representatives of the City of Pardubice, the Pardubice Region, CzechInvest, the Czech Chamber of Commerce, the Taipei Economic and Cultural Office in Prague, and other important partners. The exhibition was also open to all Foxconn employees from Pardubice and Kutná Hora. AI Infrastructure as the Foundation of the Digital Future One of the main attractions was the presentation of state-of-the-art AI infrastructure, including the NVIDIA Vera Rubin NVL72 platform. This high-performance rack-scale system demonstrated a new approach to building data centers that are evolving into so-called “AI factories” – environments designed for developing, training, and deploying artificial intelligence at scale. “The showcased solutions demonstrated how computational performance can be significantly increased while accelerating model training and reducing both operating costs and energy consumption,” said Radka Svobodová, Compliance, PR and Communications Manager at Foxconn. The exhibition also featured modular infrastructure components illustrating the practical deployment of AI in enterprise environments. Foxconn Czech Republic is already involved in the production of critical AI infrastructure, and this manufacturing capacity will continue to expand in the future. Humanoid Robotics and Digital Twins in Manufacturing Another major highlight was the demonstration of a next-generation humanoid robot developed in cooperation with NVIDIA. The robot is capable of autonomously responding to environmental changes, making decisions, and performing complex tasks such as material handling and assembly operations. The presentation also included a demonstration of the Foxconn Omniverse Digital Twin, which connects physical manufacturing operations with their virtual counterpart in real time. This technology enables process simulation, production optimization, and testing without disrupting actual operations. FOXTRON Electric Vehicles Debut in the Czech Republic Another section of the exhibition was dedicated to EVs from FOXTRON Vehicle Technologies, which were presented in the Czech Republic for the first time. Visitors could explore the compact MODEL B, offering a driving range of up to 516 km, as well as the premium seven-seat MODEL D, designed for both family and business use, with a range of up to 800 km. Both vehicles attracted considerable interest from visitors, who had the opportunity to sit inside the cars, explore their premium interiors, and take photographs with them. “Through both the design and manufacturing of electric vehicles, Foxconn is fulfilling its long-term strategy of being not only a manufacturer of products and components, but also an integrator of comprehensive next-generation mobility solutions that combine hardware, software, and proprietary platforms developed in-house,” said Radka Svobodová. Foxconn’s Strong Presence in the Czech Republic The Czech Tech Day exhibition also showcased European production, including manufacturing activities in the Czech Republic, highlighting the country’s importance within Foxconn’s global operations. Foxconn has been operating in the Czech Republic since 2000, employs approximately 4,500 people, and runs two manufacturing facilities in Pardubice and Kutná Hora. Products manufactured in Foxconn’s Czech facilities include desktop computers, monitors, printers, servers, routers, switches, supercomputers, advanced artificial intelligence systems, and portable oxygen concentrators. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us