16 March 2026, San Jose, California, and Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today confirmed its unrivalled role in pacing the AI industrial revolution by exhibiting full-system AI server racks for NVIDIA Vera Rubin NVL72 platform, and, for the first time in the United States, unveiling details of its industrial humanoid robots and scalable modular data centers at NVIDIA GTC 2026. Splashing out on technology at the premier conference on artificial intelligence, the world’s largest electronics manufacturer demonstrated its deep collaboration with NVIDIA and its in-house strength in vertical integration with an array of critical components and cutting-edge systems that power NVIDIA Vera Rubin NVL72 platform. “Foxconn’s vertical integration, precision manufacturing and future technologies come into sharp relief when we work with NVIDIA year after year. This powerful partnership enables AI factories to produce intelligence efficiently and reliably for large-scale training, inference, and agentic workloads,” said Foxconn Chairman Young Liu. Double the size of the year before, the Foxconn delegation, with over a hundred executives, engineers and scientists, at San Jose this year brings expertise on the latest advances in AI factories and physical AI, sharing the newest innovations for NVIDIA HGX and NVIDIA MGX platforms. At GTC Booth 1921, the end-to-end NVIDIA AI Factory Ecosystem showcase features Foxconn’s key building blocks across mechanical design, cooling components, and power delivery that come together to accelerate integration and support rapid deployment. Foxconn will support the latest NVIDIA RTX PRO™ 4500 Blackwell Server Edition GPUswith new servers to power demanding data processing, AI, video and visual computing workloads. For the first time in the United States, Foxconn unveiled details of its AI-powered industrial humanoid robot being developed in collaboration with NVIDIA. Both at Foxconn’s booth and GTC sessions – “Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem” and “Building and Scaling AI Factories With Digital Twins and Robotics” – Foxconn experts show how the robots autonomously execute high-precision, repetitive industrial operations – including pick-and-place, screw fastening, and material handling – demonstrating reliability and operational efficiency in real-world conditions. The robotic skills derived from actual factory scenarios are the result of combining simulation-based training with on-site iteration, leveraging NVIDIA Isaac GR00T, NVIDIA FoundationPose, NVIDIA Isaac Sim and NVIDIA Jetson Thor, to enable rapid deployment and scalable rollout across manufacturing facilities. Meanwhile, the modular data center, or MDC, redefines scalability. Foxconn, with partners, are launching a new generation of AI-ready modular and hybrid architectures to meet demand from new-generation AI models for ultra-high-density compute power and electrical infrastructure. Through highly standardized and modular designs – see a small-scale model at Booth 1921 – the complex construction of an AI data center is transformed into a replicable and expandable industrialized solution, accelerating the journey for enterprises from building compute power to realizing the business value of AI. Foxconn’s Visionbay.ai, as an NVIDIA Cloud Partner (NCP), strategically collaborates with ecosystem leaders, enabling a unified “AI+Workflow” deployment architecture – bridging foundation models, platforms, applications, and compute infrastructure. Executing a global AI infrastructure strategy exceeding 1GW of deployed capacity, Foxconn is scaling from Taiwan into strategic regions worldwide, establishing strong foundations for sovereign AI. Another capability on display at GTC is Genesis, Foxconn’s WEF-recognized AI initiative. Powered by NVIDIA Omniverse and Foxconn FactoryGPT, Genesis demonstrates a fully integrated digital-physical factory. Visitors experience how AI simulates optimal strategies within digital twins and feeds decisions back to real-world production lines – forming a continuous closed-loop optimization cycle. In Smart City, Foxconn’s CityGPT integrates with NVIDIA Metropolis to advance AI-powered transportation and safety, while Smart EV features enhancing ADAS capabilities involving FoxBrain, the Group’s proprietary, traditional Chinese large-language model. Foxconn’s integrated healthcare AI ecosystem on exhibit focuses on four clinical domains, including scrub nurse collaborative robotics, colonoscopy Agentic AI, cardiovascular digital twins, and multimodal precision treatment for breast cancer. These take medical AI from standalone model applications to a fully realized agentic AI healthcare system – capable of perception, reasoning, and action – enabling scalable clinical innovation. On March 17, GTC session Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q is dedicated to breakthroughs in quantum by the Hon Hai Research Institute, Foxconn’s R&D powerhouse looking at future technologies. Information on exhibit hall and hours can be found here. Foxconn GTC sessions and visit Booth 1921 1.    Building and Scaling AI Factories With Digital Twins and Robotics [S81508] 2.    Develop Physical AI Applications and Build Data Factories With the Robotics Ecosystem [S82100] 3.    Accelerate Hybrid Quantum-Classical Research at Scale With NVIDIA CUDA-Q [S82043]     About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

·       Revenuefor4Qandfull year2025 atrecord highs ·       CashdividendofNT$7.2arecord highsincelisting,payoutratio 52.9% ·       AIserversectortoseestronggrowthin 2026 ·       AIiscoredrivingforceinnew5-yeartransformationstrategy 16 March 2026, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced its full year and fourth quarter 2025 financial results. Full-year net profit (attributable to the parent company) totaled NT$189.3 billion and EPS of NT$13.61 reached a record high since its listing in 1991. ROE hit 11.25%, further improving overall profitability. The company also announced a cash dividend of NT$7.2 per share this year, a record high since its listing in 1991, representing a payout ratio of 52.9%, marking the seventh consecutive year that the payout ratio has exceeded 50%. Despite significant changes in tariff policies, geopolitics, and global monetary policies, the AI server sector is expected to see strong growth in 2026. At the same time, the Group also unveiled its five-year plan, focusing on AI as the core driver and three major transformation strategies: Foxconn 1.0 – Operational Excellence; Foxconn 2.0 – Intelligence-Driven Growth; and Foxconn 3.0 – Platform Value Creation. Foxconn’s 2025 full-year revenue reached NT$8.1 trillion, a year-on-year increase of 18%; gross profit reached NT$498.2 billion, up 16% for the same period; operating profit at NT$259.2 billion, rose 29% on year; and net profit (attributable to the parent company) reached NT$189.4 billion, increasing 24%. The profit growth rate exceeded the revenue growth rate, representing best practice for maximizing the Group's profitability. Gross profit margin, operating profit margin, and net profit margin were 6.15%, 3.20%, and 2.34% respectively, compared to 6.25%, 2.92%, and 2.23% in the previous year. This shows that although high-priced AI products diluted the gross profit margin, the operating profit margin steadily grew to over 3%, and profitability of the core business benefited significantly from AI products, resulting in EPS reaching NT$13.61, an increase of NT$2.60 from the previous year. In the October-December quarter, revenue totaled NT$2.61 trillion, a 22% increase from the same period a year ago; gross profit at NT$153.3 billion, was up 17% at the same time; operating profit at NT$85.6 billion, rose 33% on-year; while net profit (attributable to the parent company) at NT$45.2 billion, fell 2% from a year ago. Gross profit margin, operating profit margin, and net profit margin were 5.88%, 3.28%, and 1.73%, respectively, compared to 6.15%, 3.03%, and 2.17% for the same period a year ago. The improved operating profit margin indicates enhanced profitability in the core business. EPS reached NT$3.23, down NT$0.11 from the previous year. Looking at the fourth quarter's operating performance, Foxconn Chairman Young Liu stated that both the fourth quarter and the full year saw record-breaking revenue, exceeding expectations and achieving strong growth. The Group's full year revenue reached NT$8.1 trillion, a record high. Notably, revenue from cloud and networking products surpassed that of smart consumer electronics products for the first time even during the traditional peak season for ICT products, becoming the largest product category in the quarter. Based on the Group's target of an average cash dividend payout ratio of no less than 40%, Chairman Liu announced this year's cash dividend per share will be NT$7.2, a significant increase from NT$5.8 per share last year, with a payout ratio of 52.9%, a new high since the company's listing in 1991, and exceeding 50% for seven consecutive years. The market is paying close attention to the Group's performance in cloud and networking products and smart consumer electronics products in 2026. Chairman Liu pointed out that with the unprecedented expansion of capital expenditures by large global CSPs, Foxconn, as the world’s largest AI server provider, will definitely seize this opportunity. As production capacity gradually comes online, AI servers will maintain strong growth. Regarding smart consumer electronics products, addressing market concerns about memory shortages and price increases, Chairman Liu stated that the Group's product portfolio is mainly composed of high-priced models, and the impact is currently observed to be relatively limited. Demand, as originally seen, remains unchanged, and visibility is gradually improving, with significant growth expected this year. Regarding the financial indicators that investors are highly concerned about, Chairman Liu stated that the "Enterprise Value Enhancement Plan" approved by the board of directors Monday incorporates targets such as operating profit margin and ROE into its core commitments in order to actively respond to investors' expectations for improved long-term profitability. ROE has been around 9% in 2023 and 2024. With deeper vertical integration of components, emerging economies of scale, and growing contribution of the AI business, overall profitability further improved in 2025, with ROE reaching 11.25% to steadily move towards a near-term target of 12%. As the global industry stands at the starting point of the new AI era, Foxconn, based on its three-stage transformation plan proposed five years ago – F1.0 Existing Business Optimization, F2.0 Digital Transformation, and F3.0 Transformation To New Industries – is using AI as the core driving force to promote the Group's upgrade through three major transformation strategies: Foxconn 1.0 Operational Excellence; Foxconn 2.0 Intelligence- Driven Growth; and Foxconn 3.0 Platform Value Creation Chairman Liu stated, "Our goal is clear: to transform Foxconn from the world's most important technology manufacturing partner into the most trusted industrial platform in the AI era. This will be the core direction of Foxconn's next stage of growth and the key to continuously creating long-term value for our shareholders."

World’s first live demonstration of real-time sensor data acquisition and pre-processing on silicon, enabling up to L4 autonomous drivingNuremberg, Germany — At Embedded World 2026, ZF Friedrichshafen AG and SiliconAuto have won the Embedded Award SoC / IP / IC Design category for the co-developed ZF I/O interface chip, tightly integrated with SiliconAuto’s new XMotiv™ M3 microcontroller. Building on a non-commercial collaboration supported by Germany’s Federal Ministry of Education, the joint solution marks a breakthrough in automotive compute architecture by enabling the industry’s first live, real-time demonstration of sensor data acquisition and pre‑processing directly on silicon. The award‑winning design showcases a new I/O interface chip from ZF that integrates all essential ADAS sensor‑interface IP, along with on‑chip processing for camera and radar data, together with SiliconAuto’s XMotiv™ M3 serving as the companion controller. This achievement provides a powerful, scalable alternative to traditional monolithic SoCs. By offloading sensor data handling and pre‑processing to the I/O chip, the system frees up central-compute resources for perception and driving tasks while maintaining full OEM flexibility through standardized high‑speed interfaces such as PCIe and Ethernet. The demonstration positions the combined ZF–SiliconAuto architecture as a next‑generation foundation for ADAS and automated driving systems, from entry-level configurations up to SAE Level 4 capabilities. Be among the first to see this award‑winning technology in action. Join us at the SiliconAuto booth in Hall 4, IC&IP Design Area, Stand 4‑665, for a live demonstration of the silicon powering tomorrow’s automated driving systems. About SiliconAuto SiliconAuto is a fabless semiconductor company focused on everything that moves—cars, trucks, two-wheelers, robots and drones. Founded in 2023 as a joint venture between Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and Stellantis N.V., the company is incorporated in the Netherlands with teams in Europe, Taiwan and India. SiliconAuto provides a path into the world’s most advanced semiconductor ecosystem through a growing portfolio of automotive-grade products paired with solutions to simplify integration and help teams accelerate next-generation vehicles and robots to market. About ZF Friedrichshafen AG ZF is a global technology company supplying advanced mobility products and systems for passenger cars, commercial vehicles and industrial technology. Its comprehensive product range is primarily aimed at vehicle manufacturers, mobility providers and start-up companies in the fields of transportation and mobility. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate as well as enhancing safe mobility. Alongside the automotive sector – passenger cars and commercial vehicles – ZF also serves market segments such as construction and agricultural machinery, wind power, marine propulsion, rail drives and test systems.

3 March 2026, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced ambitious sustainability targets through 2030 that focus the next five years on clean energy, labor rights, supply chain ESG and global initiatives for the world’s largest electronics manufacturer and leading technological solutions provider. Stepping up sustainability as the Group’s core driver of long-term competitiveness and operational resilience, the 2026–2030 Long-Term Sustainability Goals, benchmarked against 2025 levels, comprise of 34 concrete actions across 21 strategic categories. The updated roadmap responds to evolving global ESG expectations and offers a broader value chain impact. “This roadmap marks Foxconn’s transition into a new phase defined by data transparency, institutionalized targets, and collaborative partnerships,” said James Wu, Foxconn Spokesperson and a lead for the Group’s Sustainability Committee. “With hundreds of campuses around the world and tens of thousands of suppliers, we are taking steady, measurable steps to bring up our ecosystem to be being cleaner, greener and smarter.” By 2030, the entire group aims to achieve multiple environment targets, including a 30% greywater recycling rate; a 75% share of renewable energy use; self-invested green electricity accounting for more than 30% of the group's renewable energy usage; and a 10% reduction in energy intensity. Foxconn, for the most part, reached its previous set of 32 long-term ESG goals issued in 2022 ahead of schedule, putting it on track to achieve its 2050 net zero emission target, while fulfulling social and governance commitments, including enhancing workplace wellness, improving sustainable supply chains and strengthening cybersecurity and board accountability. Looking ahead, AI will be embedded in sustainable technology innovation goals, such as doubling the number of Foxconn’s Lighthouse-standard factories and exponentially discovering IP-worthy applications to share with the industry. For the first time, the Group will coordinate its corporate policies and supplier standards with 15 major international frameworks, including TCFD, SASB, and IFRS S1/S2. The company is committed to maintaining a top 10% ranking across five leading ESG rating agencies, including MSCI and Sustainalytics. In bringing up the supply chain, the new goals include initiating a 100% sustainability audit of Foxconn’s Tier-1 suppliers and promoting "short-chain, low-carbon manufacturing," aiming for over 80% local sourcing of institutional materials to strengthen operational resilience in global regional economies. The health and safety of employees is a top priority for Foxconn. In this key area, goals require 100% coverage of human rights risk assessments at global production sites by 2030. For high-risk issues identified during assessments, remedial and mitigation measures will be implemented immediately. The company will continuously strengthen internal management and labor dispatch practices, and systematically promote annual audits to ensure compliance with the Group's Code of Conduct and accountability standards. Global high-risk contractors will all need to meet ISO 45001 Occupational Health and Safety Management System certification. In another first, Foxconn is incorporating Nature-based Solutions (NbS) in its sustainability initiatives. With partners, the Group will organize environmental and ecological restoration actions annually in our major production regions through 2030, reaching a global yearly total of 80,000 cumulative volunteer hours. Read our 2026-2030 Long-Term Sustainability Goals here.   About Foxconn here.

·   Advance development of competitive, zero-emission buses in Japan ·   Combines FUSO’s bus design, development and manufacturing expertise with Foxconn’s ZEV technology and global partnership network ·   New company to be established from H2 2026Mitsubishi Fuso Truck and Bus Corporation (Headquarters: Kawasaki City, Kanagawa Prefecture, President and CEO: Karl Deppen, hereafter: MFTBC) today announced plans to create a standalone bus company with partner Hon Hai Technology Group (TWSE:2317), Headquarters: Tucheng, New Taipei City, Chairman and CEO Young Liu, hereafter: Foxconn). Katsuto Kora (currently Director, Head of FUSO BUS, Mitsubishi Fuso Truck & Bus Corporation) is designated as the new company’s CEO.   The two companies previously announced the signing of a memorandum of understanding to explore strategic collaboration in zero emission, accelerating clean mobility for the Japanese commercial vehicle powerhouse and the world’s largest electronics manufacturer. Via their subsidiaries - Mitsubishi Fuso Bus Manufacturing Co., Ltd. (MFBM) and Foxtron Vehicle Technologies (TWSE:2258) – MFTBC and Foxconn plan to cooperate in the development, production, supply chain management, and sales of ZEV buses, beginning with Foxtron-developed MODEL T and MODEL U.   Today’s announcement marks the next stage in the companies’ collaboration. The new company aims to fulfil society’s demand for high quality public transportation by accelerating the development of competitive, zero-emission buses in addition to the current diesel lineup. The buses will be developed and manufactured at the company’s plant in Toyama under the FUSO name, which already has over 90 years of heritage as a CV brand. The company will be headquartered in Kawasaki, Japan.   As a bus-dedicated OEM, the new company will focus on quickly developing and launching EV buses for domestic and international markets, while continuing to improve the conventional ICE portfolio.   With local development, sourcing, production and sales channels, the company will also be able to smoothly comply with Japanese regulations, quality standards and customer needs. This will be backed by Foxconn’s ZEV expertise, high-tech competency and global partnership network to help ensure products are successful in Japan and abroad.   Karl Deppen, CEO of MFTBC: “We are excited to join forces with Foxconn. This collaboration will combine the strengths of both parties to accelerate our transformation in the bus sector. By combining FUSO and Foxconn’s extensive experience and technological know-how, we will offer customers state-of-the art solutions for public transport, thereby contributing to society both in Japan and abroad.”   “Mobility is a strategic priority for Foxconn,” said Jun Seki, Foxconn Chief Strategy Officer for EVs. “This collaboration with MFTBC will provide a comprehensive electrification solution for Japan’s transportation ecosystem. This approach will significantly shorten development cycles and enhance cost-efficiency.”   Katsuto Kora, designated CEO of New Bus OEM: “The new joint venture will integrate the corporate cultures of both companies, blending Japan’s spirit of manufacturing excellence with Foxconn’s agility and technological prowess. Given the extensive existing partnerships of both shareholders, we expect even broader collaboration opportunities in the field of future technologies in the years to come. Our focus will be on meeting customer expectationsnot only for current conventional ICE improvement but also for zero-emission transportation and leading FUSO bus into a new era of digitalization and electrification.”   Having signed the definitive agreements today, MFTBC and Foxconn aim to close the transaction in the second half of 2026. The transaction is subject to all parties involved reaching an agreement and receiving approval from the relevant Boards, shareholders and authorities. MFTBC at a Glance Mitsubishi Fuso Truck and Bus Corporation (MFTBC) is a commercial vehicle manufacturer based in Kawasaki City, Japan. 89.29% of its shares are owned by Daimler Truck AG and 10.71% by various Mitsubishi group companies. MFTBC provides trucks, buses and industrial engines under the FUSO brand with a longstanding history of over 90 years, serving approximately 170 markets worldwide. MFTBC proactively develops cutting-edge technologies such as electrification, with its eCanter being Japan’s first mass-produced electric light-duty truck. MFTBC’s heavy-duty Super Great Truck was also the first of its kind in Japan to include SAE Level 2-equivalent automated driving support technology, now a benchmark in the Japanese commercial vehicle market.   Foxconn at a Glance Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2025, revenue, unaudited and consolidated, totaled TWD8.099 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com   Foxtron at a Glance Established in 2020, Foxtron Vehicle Technologies is Taiwan’s only company with full vehicle design, development, and system validation capabilities. Leveraging decades of expertise from Hon Hai Technology Group (Foxconn) and Yulon Group in the ICT and automotive industries, Foxtron operates under the CDMS (Contract Design and Manufacturing Service) business model. With an open platform strategy, Foxtron aims to “Root in Taiwan, Expand Globally”, working alongside Taiwan’s ICT and automotive industries to drive international expansion and establish the next-generation EV ecosystem.   MFBM at a Glance Founded in1950, Mitsubishi Fuso Bus Manufacturing (MFBM) has been delivering high-quality buses to satisfied customers for over 75 years. With a state-of-the-art production facility located in Toyama, the company has achieved certification to international quality and environmental standards (ISO9001 since 2001, ISO14001 since 2003 and ISO/IATF16949 since 2018). MFBM manufactures its light duty ‘Rosa’ bus in dozens of markets worldwide and also produces large buses for both the long-distance coach (Aero Queen/Aero Ace) and city (Aero Star) segments.

15 January 2026, Taipei, Taiwan – The World Economic Forum (WEF) has recognized Vietnam’s first Sustainable Lighthouse in a world-class manufacturing facility operated by a subsidiary of Hon Hai Technology Group (“Foxconn”) (TWSE:2317), advancing the cleaner, greener and smarter leadership of world's largest electronics manufacturer and leading technological solutions provider. The benchmark designation of Foxconn Industrial Internet’s (Fii) operations in the Bac Ninh Province is the result of tangible achievements in accelerating decarbonization across complex manufacturing supply chains through the extensive application of AI technologies, achieving a 22% reduction in Scope 3 emissions, as well as a combined 34% reduction in Scope 1 and Scope 2 emissions. The recognition is a step up for the facility which was certified as Vietnam’s first WEF Lighthouse factory* in 2024. WEF Lighthouse Factories represent the highest global standards in smart manufacturing and digitalization. Sustainable Lighthouse Factories, seen as “lighthouses among lighthouses,” specifically recognize industry leaders that set exemplary benchmarks in carbon reduction and circular economy practices. In addition to meeting stringent requirements for technological advancement and operational excellence, Sustainable Lighthouse Factories emphasize performance improvements in energy efficiency, resource conservation, pollution reduction, carbon mitigation, and cost optimization. To achieve these goals, Foxconn’s Bac Ninh plant fully leveraged AI technologies to build a GenAI-based intelligent campus platform that integrates production, operations, energy management, carbon tracking, and EHS systems. This enables real-time insights and automated optimization, establishing a benchmark smart manufacturing campus. According to WEF, “Foxconn’s Bac Ninh plant has deployed more than 20 digital and AI-driven solutions, including AI-enabled green design to reduce the carbon footprint of bills of materials, a generative AI-based carbon accounting platform designed specifically for small and medium-sized suppliers, and energy efficiency optimization solutions integrating Omniverse and AI technologies.” Addressing common industry challenges such as the lack of effective carbon management tools and difficulties in advancing supplier decarbonization, the Bac Ninh plant developed an expert large-model–based carbon management platform and made it freely available to suppliers. Through standardized data reporting and automated verification, the platform increased Scope 3 emissions visibility to 90%. By combining analytical results, it also provides over 100 customized carbon reduction solutions tailored to different supplier profiles, precisely tackling supply chain decarbonization bottlenecks. (* Note: Under Vietnam’s administrative reform, Bac Ninh and Bac Giang provinces were officially merged in July 2025.)   About Foxconn here.

14 January 2026, Taipei, Taiwan – The LPGA of Taiwan (TLPGA) and the Japan Ladies Professional Golfers’ Association are thrilled to announce the “2026 Taiwan Foxconn Ladies Golf Tournament” on the official circuit of JLPGA for this year, bringing Asia’s most lucrative women’s golf tour to Taiwan for the first time in nearly half a century and an elite line-up of athletes vying for a record US$2 million purse. Stepping up the game, the competition – re-branded from Foxconn TLPGA Players Championship of the past two years – will see the return of title sponsor Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technological solutions provider, and special sponsor for the first time, Japanese technology powerhouse SoftBank Corp. Producing topflight golfers, including Hisako Higuchi and Ai Miyazato, the JLPGA was a sweet spot for Taiwan’s own golf legend Ai-yu Tu, who once swept 71 championships and was a 7x money-title winner on the JLPGA Tour, accumulating over 110 wins in her career and inducted into the Japanese Golf Hall of Fame. Ms Tu is a special advisor for the 2026 Taiwan Foxconn Ladies Golf Tournament. TLPGA Chairwoman Huang Pi-hsun said: "Ms Tu’s glorious achievements on the JLPGA Tour have been a source of pride for Taiwan. I am grateful for Foxconn's support, which has allowed this dream tour to return to Taiwan after 48 years, giving young players a stage to challenge the world." JLPGA Vice President Takako Matsuo said: "Over the past two years, we have witnessed TLPGA and Foxconn successfully taking the game to an elite playing level. As one of Asia’s flagship tournaments this year, we very much look forward to bringing Japanese players to Taiwan in March for high-level competition." The total purse is the second-highest in the JLPGA Tour for 2026 and another record for the Foxconn-sponsored tournament since it was inaugurated in 2024. Originally established as a players championship, the competition has set itself apart with its exceptional ranking points, substantial prize money, and elite sportsmanship. The 2026 Taiwan Foxconn Ladies Golf Tournament will be held March 12-15 at the Orient Golf & Country Club in Taoyuan. Follow the action and stay updated through the tournament’s official Facebook and on Foxconn’s official Instagram. About TLPGA here. About Foxconn here.