17 June 2026, Taipei, Taiwan and Paris, France – Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest artificial intelligence server provider, accelerated its global leadership in AI factories and sovereign AI infrastructure by showcasing at VivaTech its end-to-end integration capabilities that also stand up the world’s most state-of-the-art, rack-scale AI supercomputer. Considered Foxconn’s European debut and a nod to Europe's biggest startup and tech event, the world’s largest electronics manufacturer brought the cutting-edge technology – to the continent for the first time – including NVIDIA Vera Rubin NVL72, NVIDIA HGX platforms and NVIDIA MGX architectures, as well as two of its electric vehicles and advances in humanoid robotics. “Foxconn is connecting with transformation opportunities and diversified business models across European industries. By fostering technology collaboration with industry, start-ups, government and academia, we strengthen our Build-Operate-Localize presence in Europe,” said Foxconn Vice President and Spokesperson James Wu, referring to the Group’s innovative BOL business model that supports local communities. Underscoring the market’s importance, Foxconn, with partners Bull of France, a leader in advanced computing and AI, and NVIDIA also announced a strategic milestone to build the NVIDIA Vera Rubin NVL72 platform from Europe that will commercialize under the Bull brand. At Foxconn Booth 2B41, the NVIDIA Vera Rubin NVL72 represents the next frontier of Agentic AI. On display, as well, were NVIDIA HGX Rubin NVL8 and NVIDIA MGX 4U system, affirming the Group’s manufacturing strengths in high-density AI racks, compute trays, liquid cooling, power delivery, and system integration. Moreover, with its dedicated business unit for AI supercomputing & cloud operations, Visionbay.ai – which is an NVIDIA Cloud Partner (NCP) – the Group showed end-to-end solutions that cover the full stack AI factory operations to technical services and application ecosystems. For the first time in Europe, the public can see and sit in two modern EVs offered by Foxconn unit FOXTRON Vehicle Technologies under a Contract Design and Manufacturing Service, or CDMS, business model. A MODEL B sporty crossover – being sold in Taiwan under the BRIA brand – and a MODEL D lifestyle multipurpose utility vehicle represent the Group’s capabilities in EV platforms, complete vehicle design, smart cockpits and advanced electronic/electrical (E/E) architectures. Meanwhile, a wheeled humanoid demonstrates dual-arm collaboration for precision assembly tasks. The embodied intelligence is derived from actual factory scenarios, combining simulation-based training with on-site iteration to enable rapid deployment and scalable rollout across manufacturing facilities.   About VivaTech here. About Foxconn here.

Paris, France – 17 June, 2026 – As part of their recently unveiled collaboration,Bull, a leader in advanced computing and AI, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technology solutions provider, today announce a first strategic milestone with the production in Europe of key components for commercialisation under the Bull brand. This announcement builds directly on the partnership unveiled on 1 June 2026, which combines Bull’s expertise in AI systems design and deployment with Foxconn’s industrial scale and supply chain capabilities, to manufacture AI infrastructure for AI Factories and AI Cloud providers, from Europe. With the NVIDIA Vera Rubin NVL72 platform, the partnership moves into execution, bringing its industrial ambition to life through the production of advanced AI systems in Europe, and opening the path to supporting a broader set of technology architectures over time. Systems will be manufactured and initially tested at Foxconn’s facilities in the Czech Republic, before being assembled, integrated and fully validated at Bull’s factory in Angers, France. Designed for the most demanding AI workloads in the age of Agentic AI, these AI servers and data centres will address the needs of neo-cloud providers, cloud service providers and the emerging generation of AI factories across Europe and beyond. Beyond hardware, the ability to manage and operate AI infrastructure end-to-end is becoming critical. In this context, Bull is providing the AI software layer with embedded AI use cases and data science expertise to give customers greater control over how systems are deployed, secured and optimised - extending the “made in Europe” model from manufacturing to operations. Together, these developments reinforce the ambition behind the Bull–Foxconn partnership: anchoring a more resilient and efficient AI supply chain in Europe, with a competitive time to market, while enabling the emergence of scalable, high-performance infrastructure for the region’s most demanding AI workloads. Emmanuel Le Roux, CEO of Bull: “The partnership between Bull and Foxconn marked a turning point in the development of European manufacturing capacity for AI infrastructure, bringing together system design, industrialisation and supply chain execution across France and the Czech Republic. Made in Europe to serve Bull’s global AI ambitions, this initiative now takes a further step forward with the introduction of NVIDIA Vera Rubin NVL72, translating that vision into concrete solutions for the next generation of AI deployments.” James Wu, Foxconn Vice President: “Foxconn is proud to partner with Bull and NVIDIA to help build the foundation for AI factories, sovereign AI and next-generation data center infrastructure in Europe. By combining Bull’s leadership in European supercomputing, NVIDIA’s accelerated computing platform, and Foxconn’s global manufacturing and deployment capabilities, we are creating an ecosystem that can accelerate Europe’s AI ambitions and strengthen its long-term technological competitiveness.” Serge Palaric, Vice President Alliances, Global CSP & ISV EMEA, NVIDIA: “The collaboration between Bull and Foxconn, built on NVIDIA Vera Rubin NVL72, is exactly the kind of deep industrial commitment that will underpin the next chapter of AI in Europe. By anchoring high-performance AI manufacturing in France and the Czech Republic, this partnership gives European enterprises, AI factories and cloud providers access to the world's most advanced compute — on their terms, at scale, and from within Europe. NVIDIA is proud to support that ambition." Arnaud Bertrand, CTO of Outscale: “This is a decisive step forward for Europe’s digital and industrial sovereignty. With Bull and Foxconn bringing NVIDIA Vera Rubin NVL72 to life in Europe - and critical capabilities anchored in France - it sets a new benchmark for a resilient, end‑to‑end European AI supply chain, ready to support the next generation of cloud and AI services.” Damien Lucas, CEO of Scaleway: "At Scaleway, we have two obsessions: ensuring immunity from non-European extraterritorial laws and limiting technological dependencies. Thanks to this partnership, Bull is bringing a more European alternative to the market for latest-generation AI servers."   *** About Bull Leveraging nearly a century of innovations, Bull is a global leader for High-Performance Computing, Artificial Intelligence and Quantum technologies with c.720m€ in revenue and 3,000 professionals operating in 32 countries. Built on an open, end-to-end and trusted approach, Bull designs, deploys and operates hardware, software and strategic services that unlock enterprise value, accelerate scientific research and advance society. Driven by world-class R&D, backed by 1,600 patents, manufacturing excellence and data sciences expertise, Bull enables nations and industries to fully control their AI and data and to drive progress for the benefit of the planet. For more information, please visit our website and follow us on Instagram, LinkedIn, X, and Youtube. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totalled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

16 June 2026, Taipei, Taiwan and Hanoi, Vietnam – To accelerate the sustainable transformation of the global electronics manufacturing supply chain, Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest electronics manufacturer and leading technology solutions provider, hosted the “Vietnam Energy Forum: Policy, Capital & Renewable Solutions” Tuesday. The forum in Hanoi brought together key supply chain partners to explore trends in Vietnam’s energy market and new models for renewable energy investment. By collaborating with customers, supply chain partners, and industry experts, Foxconn aims to advance its 2030 long-term sustainability goals and steadily move toward its 2050 net-zero vision. The forum featured industry and technical experts from Brookfield, the Asia Clean Energy Coalition (ACEC), Reset Carbon and Schneider Electric Advisory. Discussions focused on Vietnam’s newly introduced Direct Power Purchase Agreement (DPPA) framework, with participants sharing solutions and practical experience to help supply chain partners fulfill their ESG decarbonization commitments. Starting from companies’ real green electricity needs, the forum examined market trends, capital deployment, and regulatory environments to identify viable pathways for renewable energy procurement and energy transition, providing actionable guidance for enterprises. As Vietnam continues to advance its renewable energy policies and DPPA framework, the feasibility of sourcing green electricity locally is steadily improving. However, practical implementation still involves challenges such as regulatory changes, grid conditions, and long-term supply stability. For companies with manufacturing and supply chain operations in Vietnam, establishing stable, long-term energy sources while maintaining manageable costs and risks was a key topic of discussion. In this context, Foxconn presented its Captive PPA model, which aggregates energy demand across the supply chain from the perspective of industrial power users. By integrating fund investment and asset management, the model aims to control generation costs while ensuring long-term and stable access to green electricity for industrial investors. During the forum, Foxconn also announced a strategic partnership with leading global asset manager Brookfield to jointly promote renewable energy development in Vietnam. Based on long-term power purchase agreements, the two parties plan to develop wind, solar, and energy storage projects in Vietnam with a total capacity of 1GW. With Vietnam’s regulatory environment gradually opening up and demand for green electricity in the supply chain increasing, Foxconn also plans to establish a renewable energy investment platform in Vietnam. By leveraging Foxconn’s accumulated expertise in renewable energy investment alongside Brookfield’s asset management capabilities, the platform aims to lower the barriers for industrial investors to access green power, drive the group and its supply chain toward net zero, and support the development of Vietnam’s energy infrastructure. Through a range of initiatives – including self-built solar power, additional green power procurement, and the establishment of an energy investment platform – Foxconn seeks to develop short-, medium- and long-term energy transition solutions for Vietnam’s industrial ecosystem and expand the use of renewable energy. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

15 June 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317), the world’s largest electronics manufacturer, and Schneider Electric, a global energy technology leader, today announced a strategic collaboration to help define and scale the next generation of AI data centers. As AI adoption surges, the demands on digital infrastructure are being fundamentally reshaped. This collaboration brings together Foxconn’s unmatched expertise in advanced compute platforms, AI rack integration, and global manufacturing with Schneider Electric’s leadership in power systems, cooling, and energy management. Together, the companies aim to deliver integrated, ready-to-deploy solutions that enable customers to build and operate AI infrastructure with greater speed, efficiency, and predictability across regions. Production will begin later this year. “At the pace AI is evolving, the industry requires a new model for how infrastructure is designed, built, and delivered,” said Young Liu, Chairman of Foxconn. “By combining Foxconn’s strength in AI systems and global manufacturing with Schneider Electric’s deep expertise in power and energy, we are creating a path for customers to deploy AI capacity at scale—faster, smarter, and more sustainably.” "AI demand continues to accelerate, and as compute scales to keep pace, the energy behind it becomes a fundamental enabler,” said Olivier Blum, CEO of Schneider Electric. “If we want to scale AI responsibly, these systems must be connected. This is where energy intelligencebecomes essential. At Schneider Electric, we are advancing energy tech to build the most efficient and sustainable AI factories by bringing integrated power, cooling, and digital capabilities into AI data centers. Working with Foxconn, we are helping customers build capacity with real speed, resilience, and efficiency, as energy technology partners to an industry that is firmly entering the era of intelligence."  Through this collaboration, Foxconn and Schneider Electric will co-develop next-generation reference architectures for AI data centers. The partnership will also explore innovations in closed-loop energy optimization, modular power and cooling skids, and standardized design frameworks, creating repeatable, high-performance blueprints for AI factories worldwide. By aligning manufacturing excellence with energy intelligence, the two companies are setting the foundation for a new class of AI infrastructure that is scalable by design, efficient by default, and ready to meet the accelerating demands of the AI era.     About Schneider Electric Schneider Electric is a global energy technology leader, driving efficiency and sustainability by electrifying, automating, and digitalizing industries, businesses, and homes. Its technologies enable buildings, data centers, factories, infrastructure, and grids to operate as open, interconnected ecosystems, enhancing performance, resilience, and sustainability. The portfolio includes intelligent devices, software-defined architectures, AI-powered systems, digital services, and expert advisory. With 160,000 employees and one million partners in over 100 countries, Schneider Electric is consistently ranked among the world’s most sustainable companies.www.se.com    About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us

No 2 ‘Most Honored Company’ in Technology Hardware, ex-Japan 12 June 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317) once again demonstrated its strong leadership in the technology hardware sector, according to the results of the 2026 “Asia Executive Team” rankings released by Extel. This year, Foxconn not only retained its recognition as one of Asia’s (excluding Japan) “Most Honored Companies” with an improved ranking, but also secured first place for “Best CEO” and “Best CFO,” along with seven awards covering Best Company Board, Best IR Team, Best IR Professional, Best IR program, and Best ESG Program. The results reflect strong recognition from the capital markets for Foxconn’s professional leadership and timely investor communications. This year’s Extel survey included more than 4,700 buy-side investors and 838 sell-side analysts, making it one of the most recognized rankings in the global capital markets. The number of participating companies increased from 1,600 to 2,500 this year, while a new evaluation methodology introduced in 2026 further strengthened the rigor and competitiveness of the selection process. In this year’s evaluation, Foxconn Chairman and CEO Young Liu was recognized for leading Foxconn’s global operations and capturing new growth opportunities, while CFO David Huang was praised for capital allocation amid rapid AI-driven expansion and rising capital expenditures. Investors also recognized Foxconn’s transparency and responsiveness in investor communications through NDRs, investor conferences, earnings calls, press releases, and multiple communication platforms. Chairman Liu said Foxconn is committed to its philosophy of “delivering on promises and continuously improving,” with a focus on strengthening corporate governance, operational performance, and investor communications. He said the recognition reflects not only the support of global investors, but also the dedication and execution capabilities of the company’s team. Going forward, Foxconn will continue advancing its vision of becoming a world-class enterprise and showcasing the strength of Taiwanese companies on the global stage. CFO David Huang stated that the rapid growth of AI-related businesses has increased the company’s funding needs for global expansion and capacity build-outs, bringing greater challenges to financial management. He emphasized that Foxconn proactively plans for both short- and long-term capital needs and flexibly adjusts financing tools based on market conditions to support operations while maintaining a stable financial structure. On the corporate governance front, investors recognized the independence and diversity of Foxconn’s Board of Directors, which now includes broader expertise in areas such as semiconductors, quantum technology, accounting, and taxation. Foxconn has also expanded its functional committees, maintained a majority of independent directors, and increased female board representation to over one-third of total seats. Foxconn’s Investor Relations team is committed to continuously enhancing investor engagement by improving transparency, responsiveness, and accessibility. Through initiatives such as the annual Hon Hai Tech Day, investors gain deeper insights into the Group’s latest technologies and products. In recognition of these efforts, Senior Manager Kristen Fang has been named Best IR Professional for three consecutive years. In ESG and sustainability, Foxconn’s efforts in sustainable operations, and social engagement have also gained broader investor recognition. This year, the company announced its “2026–2030 Long-Term Sustainability Goals,” outlining 34 strategic action targets across 21 categories focused on clean energy, labor and human rights, supply chain ESG, and global sustainability initiatives. Foxconn aims to turn sustainability into a key driver of long-term competitiveness, creating both business and social value while reinforcing its leadership position and long-term vision in ESG as the world’s largest electronics manufacturing services provider. About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us  

Up to 1 GW of solar & wind capacity will support industrial base & supply chain in Vietnam9 June 2026, Taipei, Taiwan – Hon Hai Technology Group (Foxconn) (TWSE:2317) and Brookfield, a leading global investment firm, today announced a strategic partnership, to invest in and develop renewable energy projects in Vietnam to support its operations, and that of its supply chain partners, across the country. The partnership will jointly develop up to 1 gigawatt (GW) of utility-scale wind, solar and battery capacity, underpinned by long-term power purchase agreement (PPA). Both parties will collaborate on the investment and asset management of targeted projects. Brookfield will leverage its Catalytic Transition Fund, which invests in renewable energy solutions in emerging markets.   Brookfield Asia Pacific Head of Energy Daniel Cheng said: “Brookfield’s partnership with Foxconn underscores the scale of corporate demand for renewable power in Vietnam, one of Asia’s fastest-growing economies. As global manufacturers increasingly turn to renewables for its cost-competitiveness, speed to market and energy security benefits, we’re seeing strong and rising demand for long-term supply from across the region. Policy momentum around Southeast Asia is also providing a second-order tailwind for renewables development and our Catalytic Transition strategy, which has been very active over the past 12 months.” Foxconn Chief Investment Officer James Tu said: “We are pleased to be a strategic partner to Brookfield to secure long-term access to renewable energy for our operations and supply chain in Vietnam. This initiative where we’re investing and managing alongside Brookfield ensures stable and cost-effective power supply for our continued growth in the region.” The partnership is expected to progress alongside Vietnam’s evolving direct PPA framework.   About Brookfield Brookfield is a leading global investment firm with more than US$1 trillion in assets under management headquartered in New York that owns and operates real assets and essential service businesses that form the backbone of the global economy. We invest on behalf of institutions and individuals around the world across infrastructure, energy, private equity, real estate, and credit—sectors critical to supporting economic growth and productivity. With a heritage spanning more than a century and operations in over 30 countries, we deploy long-term, patient capital to build the foundational assets and businesses that power a more connected, resilient, and sustainable future—seeking to build long-term wealth for our clients while delivering strong risk-adjusted returns for our shareholders. Brookfieldis a leading global owner, operator and developer of clean energy assets, with one of the world’s largest renewable energy portfolios spanning hydro, wind, solar, energy storage and sustainable solutions across five continents. Leveraging its operating expertise, scale and global reach, Brookfield develops and operates high-quality assets to support decarbonization and help accelerate the global transition to net zero. Brookfield’s Catalytic Transition Fund The Catalytic Transition Fund (CTF) is Brookfield’s dedicated vehicle to mobilise private capital into emerging markets to accelerate investment in clean energy and transition assets. Backed by US$1 billion of catalytic capital from ALTÉRRA, the fund is designed to crowd in private investment by improving risk-adjusted returns, supporting decarbonisation and scaling climate finance in underserved markets.   About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us  

New Taipei City, June 4, 2026 — Hon Hai Technology Group (“Foxconn”) (TWSE: 2317) announced that Chairman Young Liu recently met with SK Group Chairman Chey Tae-won in Taipei to discuss the future development of the global AI industry, including potential collaboration in AI servers, AI data centers, and energy solutions, with the aim of strengthening next-generation AI infrastructure competitiveness. As the global AI industry continues to expand, demand for high-performance computing (HPC) and AI infrastructure is growing rapidly. Building a comprehensive and highly efficient AI ecosystem has become increasingly critical to driving innovation and accelerating the adoption of AI applications across industries. During the meeting, the two sides exchanged views on large-scale AI data center developments in Asia, evolving market demand, and potential industry collaboration models. Leveraging its strengths in AI server vertical integration, rack-scale system integration, advanced thermal technologies, and AI data center solutions, Foxconn aims to work closely with industry partners to advance the development of next-generation AI infrastructure. With its industry-leading technological capabilities, SK Group is accelerating the development of core technologies essential for the AI era. Going forward, SK will continue to strengthen its global competitiveness through innovation in next-generation AI memory technologies. In addition, the two companies discussed opportunities in robotics, energy management, and battery technologies. By combining SK Group’s expertise in energy and critical technologies with Foxconn’s strengths in global manufacturing, system integration, and AI application deployment, both parties look forward to exploring future collaboration opportunities and creating new value in the AI era.

New Taipei City, Taiwan, June 4, 2026 — Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced a strategic collaboration with Intel (NASDAQ: INTC) to jointly accelerate the development and deployment of next-generation AI infrastructure and intelligent computing platforms. By combining Intel’s strengths in processor architecture, silicon technologies, and software ecosystem with Foxconn’s global manufacturing scale, system integration expertise, and AI data center deployment capabilities, the two companies will explore comprehensive AI solutions spanning silicon, rack, system, and application layers. The collaboration also aims to accelerate the large-scale deployment of AI-driven technologies across edge and physical AI applications. Young Liu, Chairman and CEO of Hon Hai Technology Group, said: “AI is rapidly transforming industries and society worldwide. Through our ‘3+3+3’ strategy, Foxconn continues to advance key technologies including AI, semiconductors, and next-generation communications, while driving the development of our three core platforms: smart manufacturing, smart EV, and smart city. Our collaboration with Intel will combine the strengths of both companies across computing platforms, system integration, and global supply chain capabilities to jointly build next-generation AI infrastructure, Edge AI, and Physical AI ecosystems, accelerating the adoption of AI applications worldwide.” Lip-Bu Tan, Intel CEO, said “The rapid growth of AI—especially in inference and agentic workloads at scale—is redefining what modern computing must deliver. These demands require innovation across the full stack—from new silicon and chip design to rackscale systems and extending all the way to edge and physical AI deployments. Our collaboration with Foxconn brings together two innovation leaders with deep expertise in chip design, rack-scale solutions, and global systems integration. Together, we are accelerating the delivery of end-to-end platforms that unlock new capabilities and extend the impact of AI worldwide.” Under the collaboration framework, Intel and Foxconn will work together to scale AI-driven solutions by leveraging Intel’s computing platforms, silicon technologies, and software ecosystem together with Foxconn’s system integration capabilities, manufacturing expertise, and global customer reach. In the AI Rack domain, the two companies will explore the development and commercialization of rack-scale AI infrastructure solutions, including Intel Xeon-based CPU racks and AI accelerator architectures. The collaboration will also focus on advancing high-speed interconnect technologies, thermal and liquid cooling designs, system telemetry, and AI data center scalability to deliver high-performance, energy-efficient AI deployment solutions. In the Edge and Physical AI domain, Intel and Foxconn will jointly define next-generation Edge AI and Physical AI platform architectures, targeting emerging applications such as agentic AI, edge intelligence, and robotics. The collaboration will further promote and support diverse applications across smart manufacturing, smart cities, automotive, and robotics. In addition, the two companies will explore opportunities in design services, including custom ASICs, SoCs, and system integration solutions. By combining Intel’s end-to-end silicon capabilities with Foxconn’s comprehensive design and manufacturing ecosystem, the collaboration spans silicon, modules, and systems to address global market opportunities.

＊On Monday, June 1, 2026, Foxconn, Radiall and Thales laid the foundation stone for their future joint venture at Le Barp (Nouvelle-Aquitaine) as part of the Choose France 2026 Summit, in the presence of the French Minister Delegate to the Minister of the Economy, Finance, and Industrial, Energy and Digital Sovereignty, responsible for Industry, Mr. Sébastien Martin, the President of S Business Group for Hon Hai Technology Group (Foxconn), Dr. Bob Wei-Ming Chen, the Chairman and CEO of Radiall, Mr. Pierre Gattaz, the Chairman and CEO of Thales, Mr. Patrice Caine and the President of the Nouvelle-Aquitaine Region, Mr. Alain Rousset. ＊This company, called Tessalia Technology SAS, will be dedicated to Outsourced Semiconductor Assembly and Testing (OSAT). It aims to produce more than 50 million System in Package (SiP) components per year by 2033. ＊Within the framework of the EU chips act, this project represents a major step forward in strengthening the French and European semiconductor ecosystem, increasing its capacity for innovation, strategic autonomy and competitiveness.   One year after the announcement by the President of the French Republic, Mr. Emmanuel Macron, at the Choose France 2025 Summit, of the initiation of preliminary discussions among Hon Hai Technology Group (Foxconn), Radiall and Thales, the three companies laid the foundation stone of their future joint venture at Le Barp, near Bordeaux (Nouvelle-Aquitaine), on Monday, June 1, 2026. Le Barp is located in the heart of a rich academic and industrial ecosystem, close to the “Route des Lasers” and with the presence of numerous cleanrooms and a large pool of expertise in these fields.   Foxconn, the world’s largest electronics manufacturing service provider, Radiall, a leading French manufacturer of high-performance interconnect solutionsfor demanding industries, and Thales, a global leader in advanced technologies, have named this new company Tessalia, referring to the tiles of a mosaic (from the Latin “tessella”). They are combining their strengths to create, test and assemble advanced packaging solutions for electronic chips (Systems in Package, SiP) for aerospace, telecom infrastructure, automotive and medical sectors notably. Tessalia will use an innovative encapsulation technology aimed at developing ultra-high-density packaging. This will help simplify printed circuit boards (PCBs) and create smaller, lighter components, thereby improving their integration capability. This technology is emerging as a breakthrough in terms of yields and competitiveness for future products.   Tessalia aims to: -        Be a sovereign and competitive company to meet European needs in the field of semiconductor packaging in strategic sectors. Tessalia will have access to the technology from Foxconn under agreed licensing arrangements. -        Provide to its customers a single interface to manage the entire implementation of advanced packaging for electronic chips. This vertical approach simplifies the packaging stage and guarantees reduced cycle time. It also minimises the carbon footprint of the sector by reducing round trips with multiple suppliers distributed worldwide; -        Promote an autonomous and open player able to manage the European packaging market ecosystem.   Production is expected to start at the end of 2029 and to reach more than 50 million System in Package (SiP) components per year by 2033. This initiative aims to welcome other industrial players to support an investment that could exceed €250 million by 2033. Tessalia is expected to have 800 employees at full production.   In a context of surging demand for electronic equipment and artificial intelligence, and of geopolitical tensions disrupting global supply chains, semiconductor production has become a major strategic challenge, leading to a readjustment of the sector, an acceleration of production capacities and the development of new technologies.   “This new advanced capacity is a key sovereign asset for the European and French semiconductor industry. This project aligns perfectly with Radiall’s strategy, enabling the development of our next advanced connection solutions for demanding applications.” Pierre Gattaz, Chairman and CEO, Radiall   “This is not just a factory. It is a strategic platform for advanced manufacturing, semiconductor resilience, and future technologies in Europe. This project also supports Foxconn’s strategy of Build-Operate-Localize, which expands our global technology footprint through trusted partnerships.” Young Liu, Chairman, Foxconn   “The laying of this first stone today demonstrates our shared ambition, together with Radiall and Foxconn, to build an innovative and competitive European player in the advanced semiconductor packaging market, in a context of strong competition. Tessalia is part of a drive for independence and control over the value chain of all our electronic products.” Patrice Caine, Chairman and CEO, Thales   “I am delighted to welcome this strategic factory, which is crucial for our sovereignty in the electronics sector. It strengthens our regional ecosystem in this sector, which already represents 20,000 jobs. This project also rewards our long-standing efforts in reindustrialization, which have enabled us to become the leading region in France in terms of creating factories”. Alain Rousset, Président, Nouvelle-Aquitaine Region   About Foxconn Hon Hai Technology Group (Foxconn) (TWSE:2317) is the world’s largest electronics manufacturer and leading technology solutions provider, ranking 28th in Fortune Global 500. In 2025, revenue totaled TWD8.1 trillion (approx. USD260 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40% and covers four major product segments: smart consumer electronics; cloud and networking; computing; and components and other. Operating over 240 campuses across 24 countries, Foxconn is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. We are committed to sustainability in the manufacturing process and serving as a best-practice model for global enterprises. The Group is guided by its 3+3+3 strategy, actively investing in industries of electric vehicles, digital health, and robotics; in technologies of artificial intelligence, semiconductors and next-generation communications; in intelligent platforms of Smart Manufacturing, Smart EV and Smart City. Foxconn is dedicated to becoming a comprehensive, world-class enterprise, with AI as its core driving force. Learn more at www.foxconn.com/en-us   About Radiall Founded in 1952, Radiall is a global manufacturer of advanced interconnect solutions, employing over 3,500 people worldwide. The company offers a comprehensive range of RF connectors and cables, coaxial switches, fiber optic and microwave components, multi-contact connectors and more, supported by an international presence ensuring close customer support.   About Thales Thales (Euronext Paris: HO) is a global leader in advanced technologies. Its portfolio of innovative products and services helps address several major challenges: sovereignty, security, sustainability and inclusion. The Group allocates €4.5 billion per year in Research & Development in key areas, particularly for critical environments, such as Artificial Intelligence, Cybersecurity, Quantum and Cloud technologies. Thales has more than 85,000 employees in 65 countries. In 2025, the Group generated sales of €22.1 billion.